계측장비 안내
| Technology Road Map. | EXAMPLE | 엠아이티 | Remarks | |||||
|---|---|---|---|---|---|---|---|---|
| Sample | MP | Sample | MP | |||||
| PNL SIZE | 500 | 250 | 250/500 | 250/500 | ||||
| BUTTON PLATING Capability | O | O | X | X | ||||
| Etch Factor | Min. Trace Width & Spacing |
Inner layer | Inner(um) | 60/60 | 60/60 | 50/50 | 60/60 | |
| Outer layer | Outer(um) | 60/60 | 60/60 | 75/75 | 75/75 | |||
| Button plating | Outer(um) | 60/60 | 60/60 | X | X | |||
| DRILL Factor | Min.Drill(Φ) Size |
PTH(um) | 150 | 150 | 100 | 150 | ||
| BVH(um) | 100 | 100 | 100 | 120 | ||||
| Min. PTH Annular Ring(um) | 80 | 100 | 80 | 100 | ||||
| Copper Plating | D/S기준 ,M/T 기준 | ±3㎛/±5㎛ | ±3㎛/±5㎛ | ±3㎛/±5㎛ | ±3㎛/±5㎛ | 동도금 공차 | ||
| Etch Factor | Min. Trace to NSMD Component Pad Edge(SM) | 60 | 130 | 50 | 120 | |||
| Min. Trace to SMD Component Pad Edge(SM) | 120 | 120 | 100 | 120 | ||||
| Min. Trace to NSMD Component Pad Edge(CL) | 250 | 250 | 250 | 250 | ||||
| Min. Trace to SMD Component Pad Edge(CL) | 100 | 100 | 75 | 100 | ||||
| Min. Trace Width in Ground | 200 | 200 | 100 | 150 | ||||
| Min. Space Width in Ground | 200 | 200 | 100 | 150 | ||||
| 층간 정합 공차 | 80 | 100 | 80 | 100 | ||||
| Solder Mask /Coverlay |
C/L | C/L Opening Size Tolerance (um) | ±50 | ±75 | ±50 | ±75 | ||
| Min. Coverlay Opening Size(um) | 400 | 400 | 250 | 400 | LASER 가공시(샘플) | |||
| Coverlay to External Layer Pattern Alignment Tolerance | ±125 | ±125 | ±125 | ±125 | ||||
| Solder Mask | Solder Mask Opensing Size Tolerance | ±50 | ±50 | ±50 | ±50 | |||
| Solder Mask to External Layer Pattern Aligment Tolerance | ±55 | ±63 | ±55 | ±75 | ||||
| Min. Solder Mask Opening Diameter | 150 | 200 | 150 | 200 | ||||
| Min. Solder Mask Width | 75 | 75 | 50 | 75 | ||||
| Punched Tolerance |
M/F DIE | BOARD OUTLINE TOLERANCE | 100 | 100 | 100 | 100 | ||
| ZIF FINGER TOLERRANCE | 60 | 70 | 70 | 70 | ||||
| MIN. PUNCHED HOLE DIAMETER | 500 | 600 | 500 | 500 | 두께 0.4T이하가능 | |||
| BOARD OUTLINE TO TARGET LAYER PATTERN TOLERANCE | ±90 | ±100 | ±100 | ±100 | ||||
| SRD DIE | Punched Opening Size Tolernce | ±250 | ±250 | ±150 | ±150 | |||
| Min. Radius of inside/outside Punched Corner | 750 | 750 | 500 | 750 | ||||
| PSA | Stiffner (SUS) Tolerance | 150 | 200 | 200 | 200 | |||
| impedance | Impedance Control(%) | ±6% | ±10% | 고객사협의 | ||||
| ETC | Max. Multi-Layer(Mass Production) | 8(1+N+1) With IVH |
8(1+N+1) With IVH |
8(1+N+1) With IVH |
4(1+N+1) With IVH |
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